Focus
Independent, third-party research dedicated to China's equipment, materials, and components — not a generalist consultancy.
China semiconductor intelligence
Unique insight into the Chinese semiconductor market.
ForSilicon Research delivers independent, primary-research data on China's wafer manufacturing, advanced packaging, equipment, materials, and components — the intelligence equipment makers, materials firms, and research institutes rely on to judge long-term value.
Full value-chain coverage
- 14,800+ kunits China wafer capacity forecast by 2030 ≈5× vs. 2020
- 6× domestic vs. foreign-invested capacity by 2030
- 2022–2030E forward market sizing across the value chain
Why ForSilicon
Breaking data barriers, strengthening industry foundations.
An independent third-party institute focused exclusively on China's semiconductor equipment, materials, and components — so every decision can rest on data truth you can trust.
Professional
A core team with deep experience at TSMC, Hua Hong, HHGrace, AMAT, TEL, LAM, and 3M — sharp, first-hand industry insight.
Depth
Full value-chain tracking with standardized and custom deep dives, backed by rich databases and continuous expert engagement.
Continuity
Long-term, continuous monitoring with forward-looking analysis and timely updates that support sustainable strategy.
Research products
View all products → Data across the full value chain
Wafer manufacturing
China Wafer Manufacturing Industry Operations Monitor
Comprehensive quarterly capacity and utilization analysis, plus annual sizing and forecasts for China wafer manufacturing WFE (Wafer Fabrication Equipment) spend — helping equipment, materials, components, and manufacturing support firms understand customers' current WFE scale and future incremental spend for strategy and market development.
Quarterly & annual delivery Learn more → Advanced packaging
Mainland China Advanced Packaging Industry Research
Comprehensive semi-annual capacity and utilization analysis, plus sizing and forecasts for mainland China advanced packaging WFE (Wafer Fabrication Equipment) spend — with market structure and player share insights to support strategic decisions and market development for equipment, materials, and supply-chain partners.
Semi-annual delivery Learn more → Equipment
China Semiconductor Furnace Equipment Market Research (2022-2030E)
Clarify the direction and addressable space of China's furnace equipment market to inform strategic choices. Structured around technology, market, and competitive analysis — covering equipment taxonomy and technical comparison, segment market sizing (2022-2030E), competitive landscape, and supplier–customer tool intelligence for equipment firms.
Annual · 2022-2030E horizon Learn more → Materials
China Semiconductor Materials Market Research (2022-2030E)
Clarify the direction and addressable space of China's semiconductor materials market to inform strategic choices. Structured around technology, market, and competitive analysis — covering material taxonomy and technical comparison, segment market sizing (2022-2030E), competitive landscape, and supply-chain intelligence for materials firms.
Annual · 2022-2030E horizon Learn more → Components
China Semiconductor Components Market Research (2022-2030E)
Clarify the direction and addressable space of China's semiconductor components market to inform strategic choices. Structured around technology, market, and competitive analysis — covering component taxonomy and technical comparison, segment market sizing (2022-2030E), competitive landscape, and equipment-supplier intelligence for components firms.
Annual · 2022-2030E horizon Learn more → Insights
View all insights → Research driving the conversation
When Microbumps Hit Physical Limits: How Hybrid Bonding Rewrites the Rules of Chip Stacking
Introduction In 3D packaging, there exists a fundamental technical contradiction: the higher the interconnect density, the smaller the bump pitch, and the…
Read the analysis → The platform
The trusted source for China semiconductor intelligence
An integrated network spanning universities, enterprises, media, and capital — the foundation behind our primary research.
- 20+ years of core-team experience
- 1,000+ industry connections
- 70+ university partnerships
- 60+ capital partnerships
Contact
Ready to discuss your semiconductor strategy?
Tell us who you are and how we can help — we'll follow up with sample outlines, methodology, or subscription options tailored to your organization.
- Sample outlines & methodology summaries on request
- Subscription options tailored to your organization
- Briefings for strategy, capital, and policy teams